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High-Precision Point UV Curing Light for Micro-Scale Applications

Devices, and optical assemblies, this system features intelligent thermal management, maintaining surface temperatures below 40°C even at maximum 5W/cm² output to prevent heat damage to sensitive components.

Key Features & Benefits:

Smart Pulse Control: Programmable curing cycles (1ms–9999ms) with motion-activated triggering for automated production lines.
Multi-Wavelength Options: Dual-band 365nm (deep curing) + 405nm (surface tack-free) for versatile adhesive compatibility.
Robotic Integration: RS485/Modbus protocol support for seamless automation with 6-axis robots.
Real-Time Energy Monitoring: Built-in radiometer ensures consistent UV dosage (0–2000mJ/cm²).

    Applications:

    High-Precision, On-Demand UV Curing for Micro-Scale Applications
    Our UV spot curing system delivers ultra-focused 365nm/395nm UV energy through high-transmission quartz lenses, achieving pinpoint accuracy with adjustable irradiation areas from 0.5mm² to 20mm² (±3% intensity uniformity). Designed for precision bonding in electronics, medical devices, and optical assemblies, this system features intelligent thermal management, maintaining surface temperatures below 40°C even at maximum 5W/cm² output to prevent heat damage to sensitive components.
    Key Features & Benefits:
    Smart Pulse Control: Programmable curing cycles (1ms–9999ms) with motion-activated triggering for automated production lines.
    Multi-Wavelength Options: Dual-band 365nm (deep curing) + 405nm (surface tack-free) for versatile adhesive compatibility.
    Robotic Integration: RS485/Modbus protocol support for seamless automation with 6-axis robots.
    Real-Time Energy Monitoring: Built-in radiometer ensures consistent UV dosage (0–2000mJ/cm²).
    Industry Applications:
    PCB Repair: Zero overflow curing with 0.1mm positioning accuracy, reducing rework by 60%.
    Medical Device Assembly: FDA-compliant non-contact curing for catheters and implants.
    Consumer Electronics: High-speed bonding of camera modules and flex circuits.
    Why Choose Our System?
    Unlike traditional flood curing, our spot system reduces energy waste by 70% and enables selective curing for complex geometries. The rugged aluminum housing (IP54 rated) ensures durability in harsh environments.
    This precision spot curing system delivers focused UV energy for micro-scale adhesive applications:
    Pinpoint Accuracy - 0.1mm positioning repeatability for delicate components
    Instant Curing - Achieves full bond strength in milliseconds
    Non-Contact Process - Eliminates part distortion from mechanical pressure
    Key Applications:
    Medical device micro-assembly
    Electronics component bonding
    Optical lens fixation
    Technical Advantages:
    80% energy savings compared to flood curing systems
    Integrated radiometer for dosage verification (optional)
    Compatible with robotic automation (RS485 interface)
    Note: Optional accessories include:
    Articulating light guide arms
    Stereo microscope adapter
    Multi-channel controller for simultaneous curing
    Compliance with FDA 21 CFR 1040.10 laser safety standards

    Product Details

    Model

     DGY-04-φ12mm

    Chip

     Nichia

    Band

     365nm (optional band)

    Control

     touch screen control

    Channel

     1-4 channels optional

    Mode

     Auto\Manual\Ladder mode

    Signal

     pulse\level signal

    Lifetime

     20000H

    Energy Adjustment

     0-100%

    Spot size

     3,5,6,8,10,12,15,16,20mm

    Product Details

    IMG_6318
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    IMG_6322
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    IMG_6325
    IMG_6326
    IMG_6320

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